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CSM Series
Molded Metal Plate Sensing Resistor
Stackpole Electronics, Inc.
Resistive Product Solutions
Performance Characteristics
Test Items
Temperature Coefficient of Resistance
Load Life
Short Time Overload
Moisture No Load
Temperature Cycle
Resistance to Soldering Heat
Solderability
High Temperature Exposure
Low Temperature Storage
Substrate Bending
Insulation Resistance
Condition of Test
+25oC ~ +125oC
1000 hours at rated power, 70oC,
1.5 hours ON, 0.5 hours OFF
5 X rated power for 5 seconds
85oC, 85% RH, 1000 hours
-55oC and +155oC, 300 cycles,
15 minuntes per extreme condition
260±5oC for 20±1 seconds
245±5oC for 2±0.5 seconds
170oC for 1000 hours
-55oC for 1000 hours
Bending width 2mm
100V DC for 1 minute
Test Limits
CSM2512 ±75 ppm/oC
CSM0603 ±100ppm/oC
±1%
±0.5% (for 0.04 - 0.1 Ω >
rated power x 2.5 for 5 seconds
±0.5%
±0.5%
±0.5%
At least 95% of surface area of electrode
must be covered with new solder
±0.5%
±0.5%
±1%
> 100M Ω
Storage Conditions: temperature 5oC ~ 35oC; humidity 40% ~ 75%.
Power Derating Curve:
100
80
60
40
20
CSM0603
100
80
60
40
20
CSM2512
-55
0
70
125
155
-55
0
70
170
Ambient Temperature (oC)
Solder Pad Dimensions
Ambient Temperature (oC)
Type / Code
CSM0603
CSM2512
Rev Date: 11/01/2013
a
0.039
1.00
0.157
4.00
2
b
0.028
0.70
0.083
2.10
L
0.035
0.90
0.161
4.10
Unit
inches
mm
inches
mm
www.seielect.com
This specification may be changed at any time without prior notice.
Please confirm technical specifications before you order and/or use.
marketing@seielect.com
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